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 SI1035X
New Product
Vishay Siliconix
Complementary N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) rDS(on) (W)
5 @ VGS = 4.5 V N-Channel 20 7 @ VGS = 2.5 V 9 @ VGS = 1.8 V 10 @ VGS = 1.5 V 8 @ VGS = -4.5 V P-Channel -20 12 @ VGS = -2.5 V 15 @ VGS = -1.8 V 20 @ VGS = -1.5 V
ID (mA)
200 175 150 50 -150 -125 -100 -30
1.5 V Rated
FEATURES
D Very Small Footprint D High-Side Switching D Low On-Resistance: N-Channel, 5 W P-Channel, 8 W D Low Threshold: "0.9 V (typ) D Fast Switching Speed: 45 ns (typ) D 1.5-V Operation D Gate-Source ESD Protection
BENEFITS
D D D D D Ease in Driving Switches Low Offset (Error) Voltage Low-Voltage Operation High-Speed Circuits Low Battery Voltage Operation
APPLICATIONS
D D D D Replace Digital Transistor, Level-Shifter Battery Operated Systems Power Supply Converter Circuits Load/Power Switching Cell Phones, Pagers
SC-89
S1 1 6 D1
G1
2
5
G2
Marking Code: M
D2
3
4
S2
Top View
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
N-Channel Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150_C)a _ Pulsed Drain Currentb Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa TA = 25_C TA = 85_C TA = 25_C TA = 85_C
P-Channel 5 secs
"5
Symbol
VDS VGS
5 secs
Steady State
20
Steady State
-20
Unit
V
190 ID IDM IS PD TJ, Tstg ESD 450 280 145 140 650
180 130
-155 -110 -650
-145 -105 mA -380 250 130 mW _C V
380 250 130 -55 to 150 2000
-450 280 145
Operating Junction and Storage Temperature Range Gate-Source ESD Rating (HBM, Method 3015) Notes a. Surface Mounted on FR4 Board. b. Pulse width limited by maximum junction temperature. Document Number: 71426 S-03201--Rev. A, 12-Mar-01
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1
SI1035X
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 mA VDS = VGS, ID = -250 mA VDS = 0 V, VGS = "2.8 V " Gate-Body Leakage IGSS VDS = 0 V, VGS = "4.5 V " VDS = 16 V, VGS = 0 V Zero Gate Voltage Drain Current IDSS VDS = -16 V, VGS = 0 V VDS = 16 V, VGS = 0 V, TJ = 85_C VDS = -16 V, VGS = 0 V, TJ = 85_C On-State Drain Currenta ID(on) VDS = 5 V, VGS = 4.5 V VDS = -5 V, VGS = -4.5 V VGS = 4.5 V, ID = 200 mA VGS = -4.5 V, ID = -150 mA VGS = 2.5 V, ID = 175 mA Drain-Source On-State Resistancea rDS(on) VGS = -2.5 V, ID = -125 mA VGS = 1.8 V, ID = 150 mA VGS = -1.8 V, ID = -100 mA VGS = 1.5 V, ID = 40 mA VGS = -1.5 V, ID = -30 mA Forward Transconductancea gfs VDS = 10 V, ID = 200 mA VDS = -10 V, ID = -150 mA IS = 150 mA, VGS = 0 V IS = -150 mA, VGS = 0 V N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch N-Ch P-Ch 0.5 0.4 1.2 -1.2 V S 250 -200 5 8 7 12 9 15 10 20 W mA 0.40 V -0.40 "0.5 "0.5 "1.5 "1.0 1 -1 "1.0 "1.0 "3.0 "3.0 500 -500 10 -10 nA mA m
Symbol
Test Condition
Min
Typ
Max
Unit
mA m
Diode Forward Voltagea
VSD
Dynamicb
N-Ch Total Gate Charge Qg N-Channel VDS = 10 V, VGS = 4.5 V, ID = 150 mA Gate-Source Charge Qgs P-Channel VDS = -10 V, VGS = -4.5 V, ID = -150 mA P-Ch N-Ch P-Ch N-Ch P-Ch N-Channel VDD = 10 V, RL = 47 W ID ^ 200 mA, VGEN = 4.5 V, RG = 10 W P-Channel VDD = -10 V, RL = 65 W ID ^ -150 A, VGEN = -4.5 V, RG = 10 W N-Ch P-Ch N-Ch P-Ch 750 1500 75 pC 150 225 450 75 80 ns 75 90 Turn-Off Time tOFF
Gate-Drain Charge
Qgd
Turn-On Time
tON
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing.
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2
Document Number: 71426 S-03201--Rev. A, 12-Mar-01
SI1035X
New Product
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Output Characteristics
0.5 VGS = 5 thru 1.8 V 0.4 I D - Drain Current (mA) I D - Drain Current (A) 600 TJ = -55_C 500 25_C 400 125_C 300
Vishay Siliconix
N CHANNEL
Transfer Characteristics
0.3
0.2
200
0.1 1V 0.0 0 1 2 3 4 5 6
100
0 0.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
40 r DS(on) - On-Resistance ( W ) 100 VGS = 0 V f = 1 MHz 30 C - Capacitance (pF) 80
Capacitance
Ciss 60
20
40 Coss
VGS = 1.8 V 10 VGS = 2.5 V VGS = 4.5 V 0 0 50 100 150 200 250
20
0 0
Crss 4 8 12 16 20
ID - Drain Current (mA)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 150 mA 4 1.60
On-Resistance vs. Junction Temperature
r DS(on) - On-Resistance ( W) (Normalized)
1.40 VGS = 4.5 V ID = 200 mA
3
1.20 VGS = 1.8 V ID = 175 mA
2
1.00
1
0.80
0 0.0
0.2
0.4
0.6
0.8
0.60 -50
-25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Document Number: 71426 S-03201--Rev. A, 12-Mar-01
www.vishay.com
3
SI1035X
Vishay Siliconix
New Product
N CHANNEL
On-Resistance vs. Gate-to-Source Voltage
50 TJ = 125_C r DS(on) - On-Resistance ( W ) I S - Source Current (mA) 40 ID = 200 mA
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
1000
100 TJ = 25_C
30
ID = 175 mA
10
TJ = 50_C
20
10
1 0.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5 6 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Threshold Voltage Variance vs. Temperature
0.3 3.0
IGSS vs. Temperature
0.2 V GS(th) Variance (V) ID = 0.25 mA 0.1 IGSS - (mA)
2.5
2.0
-0.0
1.5
-0.1
1.0 VGS = 2.8 V
-0.2
0.5
-0.3 -50
-25
0
25
50
75
100
125
0.0 -50
-25
0
25
50
75
100
125
TJ - Temperature (_C)
TJ - Temperature (_C)
BVGSS vs. Temperature
BVGSS - Gate-to-Source Breakdown Voltage (V) 7 6 5 4 3 2 1 0 -50
-25
0
25
50
75
100
125
TJ - Temperature (_C)
www.vishay.com
4
Document Number: 71426 S-03201--Rev. A, 12-Mar-01
SI1035X
New Product
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Output Characteristics
0.5 VGS = 5 thru 2.5 V 0.4 I D - Drain Current (A) 1.8 V 0.3 I D - Drain Current (mA) 2V 400 500 TJ = -55_C 25_C
Vishay Siliconix
P CHANNEL
Transfer Characteristics
300
125_C
0.2
200
0.1
100
0.0 0 1 2 3 4 5 6
0 0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
25 r DS(on) - On-Resistance ( W ) VGS = 1.8 V C - Capacitance (pF) 20 120 VGS = 0 V f = 1 MHz
Capacitance
100
80
Ciss
15 VGS = 2.5 V 10 VGS = 4.5 V 5
60
40 Coss 20 Crss 0 4 8 12 16 20
0 0 200 400 600 800 1000
0
ID - Drain Current (mA)
VDS - Drain-to-Source Voltage (V)
Gate Charge
5 V GS - Gate-to-Source Voltage (V) VDS = 10 V ID = 150 mA 4 1.6
On-Resistance vs. Junction Temperature
r DS(on) - On-Resistance ( W) (Normalized)
1.4 VGS = 4.5 V ID = 150 mA 1.2
3
2
1.0
VGS = 1.8 V ID = 125 mA
1
0.8
0 0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.6 -50
-25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (_C)
Document Number: 71426 S-03201--Rev. A, 12-Mar-01
www.vishay.com
5
SI1035X
Vishay Siliconix
New Product
P CHANNEL
On-Resistance vs. Gate-to-Source Voltage
50 TJ = 125_C r DS(on) - On-Resistance ( W ) 40 ID = 150 mA 30
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
1000 IS - Source Current (mA)
100 TJ = 25_C TJ = -55_C 10
20
10 ID = 125 mA
1 0.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5 6 VSD - Source-to-Drain Voltage (V) VGS - Gate-to-Source Voltage (V)
Threshold Voltage Variance vs. Temperature
0.3 3.0
IGSS vs. Temperature
0.2 V GS(th) Variance (V) ID = 0.25 mA 0.1 IGSS - (mA)
2.5
2.0 VGS = 2.8 V
-0.0
1.5
-0.1
1.0
-0.2
0.5
-0.3 -50
-25
0
25
50
75
100
125
0.0 -50
-25
0
25
50
75
100
125
TJ - Temperature (_C)
TJ - Temperature (_C)
BVGSS vs. Temperature
BVGSS - Gate-to-Source Breakdown Voltage (V) 0 -1 -2 -3 -4 -5 -6 -7 -50
-25
0
25
50
75
100
125
TJ - Temperature (_C)
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6
Document Number: 71426 S-03201--Rev. A, 12-Mar-01
SI1035X
New Product
TYPICAL CHARACTERISTICS (TA = 25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5
Vishay Siliconix
N OR P CHANNEL
0.2
Notes:
0.1 0.1 0.05
t1 PDM
0.02
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA =500_C/W
Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (sec)
3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
Document Number: 71426 S-03201--Rev. A, 12-Mar-01
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7


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